Home/Products/Glass machinery/Picosecond laser glass cutting machine
皮秒激光玻璃切割机

iGA-LC5050

Picosecond laser glass cutting machine

Pairs picosecond laser cutting with a separate CO₂ breaking unit for fine glass profiles.

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Understand what each component does.

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Picosecond laser and Bessel head

The proposal specifies a 60 W, 1064 nm picosecond source; thickness depends on the glass.

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CCD positioning

A telecentric camera recognizes reference marks for workpiece alignment.

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Granite platform and vacuum holding

The granite platform supports motion while vacuum holding locates the glass.

Separate CO₂ breaking unit

A separate breaking station uses the specified 150 W CO₂ laser tube.

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Read the essentials. Confirm the full configuration.

Key specifications

Cutting area500 × 500 mm
Picosecond power60 W
Wavelength1064 nm
Single-pass thickness1–8 mm,视材料而定 / material-dependent
Cutting speed0–300 mm/s
Repeatability≤ ±0.003 mm

SERVICE & SUPPORT

Support for your equipment.

Application consultation

Discuss materials, processes and sample-testing needs before selecting the configuration.

Training & operation

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Technical assistance & parts

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Questions before choosing your equipment

Product video to be added

A genuine machine demonstration will be placed here.

Can this model process my material?

Provide material type, dimensions and required results. Ask our team to review the application before confirming the configuration.

What does the quotation include?

Request an itemized scope covering equipment, options, tooling, software, transport and agreed services as applicable.

How are installation and training arranged?

Confirm site preparation, service responsibilities and training format in the order. Arrangements depend on the selected equipment.

How are delivery and warranty confirmed?

Confirm the delivery schedule, warranty scope and spare-part process in writing for the agreed configuration.

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Get a quote for your application

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